电子线路的微孔金属化在电镀铜工艺中的应用

Electronic Circuit Microvoid Metallization in the Application of the Copper Plating Process

电镀铜残留的添加剂会导致铜在退火过程中很难产生大金属颗粒,造成孔洞缺陷。为此,将电子线路的微孔金属化技术应用于电镀铜工艺中,分析了电镀铜工艺的原理。介绍了电镀铜工艺中的重要阶段,包括电镀液与化学添加剂的选择阶段和退火阶段。分析了电子线路微孔金属化的实现过程,包括除油和整孔、微蚀、浸酸和预浸、活化和加速以及电镀锌。通过电子线路的微孔金属化对电镀铜工艺中的孔洞缺陷进行修复,以增加电镀铜的导电性能。实验结果表明,将电子线路的微孔金属化应用于电镀铜工艺后,电镀铜外观明显变得光滑且带有金属光泽,且镀层导电能力大大增强,说明电子线路的微孔金属化能够有效解决电镀铜工艺中的孔洞缺陷问题。

Copper plating additives can cause of residual copper in the annealing process is difficult toproduce large metal particles,causing hole defect.To this end,the application of the microvoidmetallization technology of electronic circuits in copper plating process,the principle of copper platingprocess were analyzed.Very important stage in the process of electroplating copper are introduced,including the selection of plating solution and chemical additives and annealing.Analyzes the circuitimplementation of microvoid metallization process,including degreasing and whole hole,micro erosion,pickled and presoak,activation and accelerate and electric galvanized.By electronic circuit microvoidmetallization in the process of electroplating copper hole defect repair,in order to increase theconductivity of copper plating.The experimental results show that the application of the microvoidmetallization of electronic circuit in copper plating process,electroplating copper appearance obviouslybecome smooth and with a metallic luster,and coating conductive ability increases greatly,the microvoidmetallization of electronic circuit can effectively solve the problem of hole defects in the process ofelectroplating copper.