摘要
针对因触摸板结构差异导致按键灵敏度变化的问题,基于开放式电容器原理的基础上,提出了调整底部接地区域填充率及顶部覆盖层厚度的设计方法。设计通过对触摸板初始电容、寄生电容和尺寸大小的研究,分析了影响触摸板灵敏度的因素。研究得出可采用50%~70%填充率的底层铺铜,并在顶层覆盖0.13mm^0.6mm厚度的绝缘层的方法。该方法在保证触摸板高灵敏度的同时能增强抗干扰能力,对指导触摸板产品参数设计具有实际意义。
For the problem of the key sensitivity caused by touch panel structure differences,based on the basis of the principle of open type capacitor,put forward the adjustment at the bottom of the grounding area filling rate and thickness of top layer design method.This design focused on the touch-pad initial capacitance and parasitic capacitance and the size,analyzed the factors which affected the touch-pad sensitivity.Research showed that the touch-pad by50%~70%fill rate spreads the bottom of the grounding coppers and the top cover0.13mm^0.6mm thickness of insulating layer.This method guaranteed the touch-pad high sensitivity can enhance the ability to resist interference and has a realistic significance for guiding the touch-pad production design parameters.
作者
周书宇
郭庆
许金
柳振
Zhou Shuyu;Guo Qing;Xu Jin;Liu Zhen(Guilin University of Electronic Technology, Guangxi, Guiling, 541004, China)
出处
《仪器仪表用户》
2018年第2期11-14,82,共5页
Instrumentation
关键词
触摸按键
填充率
绝缘层覆盖
灵敏度
touch buttons
fill rate
insulation cover
sensitivity