半绝缘半导体电阻率无接触测试设备的研究

Development of Contactless Mapping Equipment of Resistivity for Semi-insulating Semiconductors

半绝缘半导体包含了第二代和第三代半导体,它们在微波、光电子、新能源及微电子领域有着广泛的应用,电阻率一般在10~5Ω·cm^10^(12)Ω·cm之间。要研究此类新材料的电阻率分布状况已无法用现有的探针法、霍尔法、I-V法实现。因此,参照德国din标准及我国电子行业标准,用TDCM法研发了"半绝缘半导体电阻率分布测绘仪",设计并研制了电容性探头、高精度三维测试台,开发了以拟合曲线为基础的数据处理及绘图软件,实现了对直径6英寸以下SiC、GaAs、CdZnTe等晶片的无接触电阻率扫描测绘,给出了彩色分布图。

Semi-insulating semiconductors contain the second and the third generations of semiconductors.They are widely used in microwave,optoelectronics,new energy and microelectronics.Their resistivity is generally lying between105Ω?cm^1012Ω?cm.It is impossible to survey the resistivity distribution of these new type materials with the existing probe method,Hall method and I-V method.Referring to the DIN standard of Germany and electronics industry standards of China,we developed the mapping instrument of resistivity distribution for semi-insulating semiconductors with the TDCM method,and designed and developed a capacitive probe,high precision3D test bench,and the data processing and drawing software as well.So the contactless scanning and mapping of resistivity of6inch SiC and GaAs chips are realized.