摘要
研究了复合添加Ga/Nd元素对超低银Sn-0.3Ag-0.7Cu钎料微焊点力学性能的影响.结果表明,复合添加适量Ga/Nd元素可以显著改善微焊点界面组织,抑制微焊点界面附近金属间化合物的生成,从而提高微焊点的力学性能,相比母合金微焊点剪切力提高幅度达到约16%;微焊点的力学性能随着时效时间的增加而降低,降低幅度优于未添加Ga/Nd的微焊点.Sn-0.3Ag-0.7Cu-0.5Ga-0.1Nd钎料微焊点的力学性能在时效处理后仍保持较好的水平,已接近Sn-3.8Ag-0.7Cu钎料微焊点的90%,具有良好的工业应用前景.
The effect of Ga/Nd addition on mechanical property of micro joint soldered with Sn-0. 3 Ag-0. 7 Cu containing ultra-low silver content was investigated. The results indicated that the addition of Ga/Nd could refine the interfacial microstructure of soldered joint and inhibit the formation of intermetallic compounds,thus improve the mechanical properties of soldered joint. The optimal shear load of soldered joint was obtained when the addition of Nd was 0. 1 wt. %. After aging treatment,the shear load of joint Sn-0. 3 Ag-0. 7 Cu-0. 5 Ga-0. 1 Nd decreased but still maintained 90% of that of joint soldered with Sn-3. 8 Ag-0. 7 Cu. The developed solder has good application prospect.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2017年第12期29-32,共4页
Transactions of The China Welding Institution
基金
国家自然科学基金青年科学基金资助项目(51605226)
新型钎焊材料与技术国家重点实验室开放课题(郑州机械研究所)SKLABFMT201604
2017浙江省博士后科研项目择优资助
关键词
无铅钎料
微焊点
力学性能
稀土元素
lead free solder
micro joint
mechanical property
rare earth
