结构功能一体化TR组件关键电路设计

Key circuits design of TR module incorporating structure and function

针对Ka频段结构功能一体化TR(Transmitter and Receiver)组件的研制,给出了关键电路的设计方案,包括多通道多功能射频芯片设计、子阵电路布局、射频垂直互联设计、功分网络设计、射频和低频接口设计等。这些方案有利于将TR组件的芯片有源电路、无源网络、液冷散热微流道以及贴片天线共同一体化集成在一个25层的低温共烧陶瓷(LTCC)基板上,从而实现TR组件的高密度设计。

The design schemes of key circuits of a Ka-band TR module incorporating structure and function were proposed,including multi-channel multi-function RF chip design,sub-array layout design,RF vertical interconnection design,power divider network design,RF and LF sockets design.These design schemes facilitate the integration of active chip circuits,passive networks,liquid cooling micro-channels and patch antenna of the TR module on a25-layer low-temperature co-fired ceramic(LTCC)board,thus high-density design of the TR module is achieved.