铜-乙二胺-硫代硫酸盐浸金体系中硫代硫酸盐消耗研究

Study on thiosulfate consumption in copper-ethylenediamine-thiosulfate gold leaching system

硫代硫酸盐浸金体系是一种绿色浸金体系,与传统的铜氨体系相比,铜-乙二胺体系展现出更好的稳定性。在模拟浸金的基础上,分别考察了pH、铜离子浓度、乙二胺浓度、硫代硫酸盐浓度等因素对硫代硫酸盐消耗率的影响。结果表明:pH值为9~10时,硫代硫酸盐消耗率较小,约为17%~18%;乙二胺浓度为0.01~0.04 mol/L时,硫代硫酸盐消耗率呈下降趋势;铜离子浓度为0.002~0.010 mol/L时,硫代硫酸盐消耗率逐渐增大;硫代硫酸盐浓度越低,其消耗率越高。研究结果可为铜-乙二胺-硫代硫酸盐浸金工艺提供一定的理论依据。

Thiosulfate leaching gold system is a green process.The copper-ethylenediamine system shows better stability than the conventional copper-ammonia solution.The effects of pH,copper ion concentration,ethylenediamine concentration and thiosulfate concentration on the thiosulfate consumption rate were investigated respectively on the basis of simulated gold leaching.The results show that when pH is9-10,the thiosulfate consumption rate is relatively low,approximately17%-18%;when ethylenediamine concentration is0.01-0.04mol/L,the thiosulfate consumption rate declines;when copper ion concentration is0.002-0.010mol/L,thiosulfate consumption rate ascends;the lower thiosulfate concentration is,the higher consumption rate is.The research can provide basis for further study on the copper-ethylenediamine-thiosulfate gold leaching system.