集成电路自动封装设备的压机控制技术

Press Control Technology of IC Automatic Packaging Equipment

压机是集成电路自动封装设备的核心部分,压机控制技术的先进性直接影响着封装设备、封装工艺和封装产品的先进性。从实际出发,以集成电路自动封装设备的核心部分为研究对象,重点研究了压机控制技术中的工艺流程、温度控制、压力控制等问题。

As the core part of IC automatic packaging equipment,press control technology has a direct impact on the packaging equipment,technology and product by its advancement.In view of practical using,taking the core part of IC automatic packaging equipment as a research object,this paper mainly studied the process flow,temperature and pressure control of the press control technology,which provides important theoretical and practical significance.