热辐射在电子设备热仿真中的影响

Influence of Thermal Radiation on Thermal Simulation about Electronic Equipment

热仿真分析作为电子设备前端设计的重要手段,其结果受到多种因素的影响。为了探究热辐射对于热仿真分析结果的影响程度,举例进行说明。案例为一个结构简单的插箱式电子设备,经过前期散热设计,采取了一些散热措施,发热器件的温升得到有效控制。然后对该模型参数进行重新设置,在求解控制器中关闭了热辐射功能。对比考虑热辐射和不考虑热辐射两种情况对于计算结果的影响,发现不考虑热辐射时元器件的温升显著提高,与实际情况不符。

As an important tool of concept design of electronic equipment,the results of thermal simulation analysis are influenced by many factors.In order to make research onhow heat radiation influenced the results of the thermal simulation analysis,one case is introduced.The case is a simple box electronic equipment.After the previous thermal design,some thermal measures were adopted and then the temperature rise was controlled effectively.Next step the parameters of the model were reset,the function of heat radiation was shut off in the solution controller.Influences on the solution results of what the heat radiation was considered or not in the case were compared.It indicates that when the heat radiation was not considered the temperature of the components rose remarkably,which is discrepant with the fact.