超低轮廓压延铜箔表面处理生产工艺研究

Study on Production Process of Surface Treatment of Ultra Low Profile Rolled Copper Foil

低轮廓铜箔具有直流电阻小、介电常数小特点,尤其是在高频高速信号传输中,存在趋肤效应的现象,导体内部的电流的不均匀,电流趋向在导体表面富集,频率越高趋肤效应越强,导致损耗越大。重点从压延铜箔表面处理粗化的工艺(电流密度、铜离子浓度、溶液温度、添加剂)等方面进行研究,以实现铜箔毛面粗糙度降低(Rz≤1.5),同时保证铜箔抗剥离强度(≥0.8 N/mm)满足基板的需求,从而保证终端电子产品的可靠性。

Low profile copper foil has the characteristics of small direct current resistance and small dielectric constant.Especially in the high-frequency and high-speed signal transmission,there exists the phenomenon of skin effect,the uneven current in the conductor,the current tends will be concentrated on the conductor surface.The higher the frequency,the stronger the skin effect,results in greater loss.The roughening process(current density,copper ion concentration,solution temperature,additives)of rolled copper foil surface were focused on in order to reduce the roughness of copper foil matte surface(Rz≤1.5)Peel strength(≥0.8 N/mm)to meet the needs of the substrate,so as to ensure the reliability of the terminal electronic products.