摘要
氧化铝HTCC陶瓷与有机印制电路板间热膨胀系数的差异较大,板级互连可靠性成为大尺寸陶瓷阵列封装面临的主要问题之一。介绍了常见陶瓷阵列封装结构及其互联可靠性问题。高热膨胀系数(HITCE)陶瓷材料具有独特的特性,在封装中的应用可以提高其板级互联可靠性。采用有限元仿真分析方法,对比分析了HITCE陶瓷封装和HTCC陶瓷封装温循条件下的板级互连可靠性。
Due to the big CTE mismatch between HTCC alumina ceramic and organic PCB,board level interconnection reliability has become a severe problem for ceramic land grid array packages.The paper takes an overview to the structures and interconnection problems of CLGA.Owe to its special material property,HITCE ceramic has a better board level reliability.The board level reliability between HITCE ceramic and HTCCceramic packages under thermal cyclingis compared with the method of finite element method.
作者
蒋长顺
仝良玉
张国华
JIANG Changshun;TONG Liangyu;ZHANG Guohua(China Electronics Technology Group Corporation No.58 Research Institute,Wuxi 214035,China)
出处
《电子与封装》
2018年第1期1-4,共4页
Electronics & Packaging
关键词
陶瓷阵列封装
互联可靠性
HITCE陶瓷
ceramic grid arraypackage
interconnection reliability
HITCEceramic
