摘要
基于智能IC卡封装代工模式,建立卡片制造商基准封装良率与封装利润之间的关系模型。客户设定封装良率目标越高,越有利于客户,但是卡片制造商的单张卡片封装利润最大值会变小,越不利于卡片制造商。无论客户设定封装良率目标多少,卡片制造商为了追求卡片封装利润最大化,都会采取基准封装良率小于或等于客户设定的封装良率目标的策略,在每次供货时赔付客户额外的模块损失,其中双方的封装良率差距由单张卡片封装良率控制系数决定。单张卡片封装良率控制系数越小,表明卡片制造商的封装能力越强,卡片封装利润最大值越大。卡片制造商需要持之以恒地降低单张卡片封装良率控制系数,从而提高生产线封装能力。
Based on OEMmode of smart IC card production,the relationships of assembly yield and assembly profit were built for card manufacturer.Higher assembly yield target is,more advantageous it becomes for customer,then smaller maximum assembly profit gets,more disadvantageous it becomes for IC card manufacturer.No matter how many assembly yield target customer requests,baseline assembly yield is not always more than assembly yield target and IC card manufacture compensates customer for extra losing IC module,then IC card manufacture can achieve maximumassembly profit.Here,the gap of both assembly yield is decided by assembly yield control coefficient.The small assembly yield control coefficient shows strong assembly ability and more assembly profit,so IC card manufacturer need continue to reduce assembly yield control coefficient to enhance assembly ability.
作者
张贺丰
纪莲和
王文赫
ZHANG Hefeng;JI Lianhe;WANG Wenhe(State GridKey Laboratory of Power Industrial Chip DesignandAnalysis Technology,BeijingSmart-Chip Microelectronics Technology Co.,Ltd.Beijing 100192,China;Beijing Engineering Research Center of High-reliability IC with Power Industrial Grade,Beijing Smart-Chip Microelectronics Technology Co.,Ltd.Beijing 100192,China)
出处
《电子与封装》
2018年第1期43-48,共6页
Electronics & Packaging