等离子物理气相沉积热障涂层研究进展

Research Process in Plasma Spray Physical Vapor Deposited Thermal Barrier Coatings

等离子物理气相沉积(plasma spray-physical vapor deposition,PS-PVD)是一种最近发展的功能薄膜与涂层制备技术。该技术结合了等离子喷涂(PS)和物理气相沉积(PVD)两种技术的特点,可以实现气、液、固多相的快速共沉积,进行涂层/薄膜微结构的高度柔性加工,并可实现复杂工件遮蔽区域的非视线均匀沉积,在热障涂层、环境障涂层、超硬耐磨涂层、透氧膜和电极膜等领域具有广阔的应用前景,被认为代表了高性能热/环境障涂层制备技术的发展方向。本文综述了PS-PVD的工作原理、技术特点以及近年来国内外在PS-PVD热障涂层制备科学和沉积机理等方面的研究进展,展望了新型高性能热障涂层制备技术的研究热点及未来的发展方向。

Plasma spray physical vapor deposition(PS-PVD)is a newly developed processing technology for advanced functional coatings and films.PS-PVD is featured with the advantages of plasma spray(PS)and physical vapor deposition(PVD)and can be used for high efficient co-deposition of vapor phases,liquid droplets and solid particles,with the capability of highly flexibility in building up various microstructure architectures.Besides,uniform deposition of the coatings or films can be achieved by this technology even on the non-line-of-sight areas of those components with complex geometry.Owing to the above merits,PS-PVD shows very promising potential in the fields of thermal barrier coatings(TBCs),environmental barrier coatings(EBCs),super-hard and wear-resistant coatings or films,oxygen permeable membranes and electrode membranes.Further,PS-PVD is recognized as the processing technology for advanced TBCs in the future.In this paper,physical principles and recent research progress in preparation and deposition mechanisms of PS-PVD TBCs are briefly introduced and summarized.The future development trends of PS-PVD in new thermal barrier coatings are prospected