一种Ka频段瓦片式接收组件的设计与实现

Design and Implementation of a Ka Band Tile-type Receiver Module

根据机载卫星通信系统低轮廓天线的需求,应用微组装工艺设计了一种由53层LTCC微波基板组成的Ka频段2×2瓦片式接收组件,集成了低噪声放大器、移相器、衰减器及微波分合路网络等电路。对瓦片式组件的垂直互联、通道间互耦等关键技术开展了研究,采用补偿的同轴结构、优化腔体布局等措施解决了垂直互联传输损耗大及通道相互干扰的问题。采用BGA球进行基板间三维高密度互联,集成了34只各类元器件。测试结果与方案设计指标一致,接收组件噪声系数小于2.1 d B,通道增益大于20 d B,功耗小于0.5 W,重量仅为3 g,尺寸为14.2 mm×14.2 mm×4.5 mm。

According to the demand of low profile antenna for airborne satellite communication system,a Ka band 2×2 tile-type receiver module is designed by micro-assembly,using 53 layers of LTCC microwave substrate.The module integrates low noise amplifiers,phase shifter,attenuators,splitting network and other circuit.The key technologies such as vertical interconnection and coupling between channels are studied,by adopting the improved compensated coaxial structure,optimizing the cavity layout,the vertical interconnection transmission loss is reduced and the channel interference is improved.It also uses BGA ball for three-dimensional high-density interconnect between substrates,and integrates 34 components.Test results are consistent with the design,the noise figure of the module is less than 2.1 dB,the gain is greater than 20 dB,the channels power is less than 0.5 W,the weight is only 3 g,and the size of the 2×2 module is 14.2 mm×14.2 mm×4.5 mm.