摘要
某电子设备在振动环境下工作时,电路板上的振动量级放大过大,引起元器件引脚与焊盘脱落,最终导致产品故障。通过对电路板上震动响应曲线进行采集和分析,对电路板及结构进行模态仿真的方法,确定了振动量级放大的原因;随后通过消除结构件装配间隙、增加安装螺钉、增强大体积元器件灌胶措施等方法,开展了优化设计工作;最后经试验验证,改进方案切实有效,提高了设备的振动环境适用性,从而大大提高了产品的可靠性。
In this paper,by collectting and analyzing the vibration response curve on the circuit board,modal simulation both in the circuit board and the structural parts,the reason for the magnification of the vibration is determined.By removing the gap of the strucural parts,increasing the mounting screws,strengthening the glue-potting measures of the big volume components,the optimization design is carried out.
出处
《工业控制计算机》
2018年第1期134-135,143,共3页
Industrial Control Computer
关键词
电路
振动环境
模态仿真
装配紧固性
灌胶
electric circuit
vibration enviroment
modal simulation
assembling tightness
glue potting
