新型咪唑衍生物固化促进剂对环氧/酸酐体系的催化活性

Catalytic Activity of New Curing Accelerator Imidazole Derivatives on Epoxy/Anhydride System

采用自制的一种新型含羟基咪唑衍生物固化促进剂(HPID),通过非等温差示扫描量热(DSC)法研究了该固化促进剂对环氧树脂(EP)/酸酐体系固化反应的催化活性,对比分析了无促进剂时及分别加入HPID和常用固化促进剂DMP–30时EP/酸酐体系的固化特征温度,并应用Kissinger和Crane方程对3种体系固化动力学进行了分析,同时研究了HPID用量对体系浇铸体玻璃化转变温度(Tg)的影响,并与DMP–30进行了对比。结果表明,HPID明显降低了无促进剂体系的固化反应表观活化能和固化特征温度,其对EP/酸酐体系固化反应的促进作用与DMP–30相近,随HPID用量增加,浇铸体的Tg下降。当HPID用量为1.5份时,体系固化反应的表观活化能为76.821 kJ/mol,反应级数为0.913 4,反应较为复杂,相应浇铸体的Tg达到181.01℃,比加入DMP–30的浇铸体提高了31.48℃,耐热性得到明显提高。

A new curing accelerator imidazole derivatives(HPID)containing hydroxyl prepared by self was used and catalytic activity of HPID in curing epoxy resin/anhydride system was studied by non-isothemal DSC method.A contrastive analysis for curing characteristic temperature of the system with different accelerators including DMP–30,HPID and non-accelerator additives was made,the curing kinetics was also studied by Kissinger and Crane equation.The effects of HPID content on glass transition temperature(Tg)of the system casting resin were studied and also compared with the effects of DMP–30.The result show that the activation energy and curing characteristic temperature are reduced obviously by the new curing accelerator HPID in comparison to nonaccelerator system.The acceleration effects of HPID on the curing reaction is same to DMP–30.Tg of the casting resin decreases with the increase of HPID content.When HPID content is 1.5 phr,the activation energy of curing reaction for the system is 76.821 kJ/mol and the reaction order value is 0.913 4,which indicates that the HPID accelerated system has a complicated curing mechanism,Tg of the casting resin added by HPID is 181.01℃and improves by 31.48℃compared with the casting resin added by DMP–30,the heat resistance is increased obviously.