摘要
以绝缘栅双极晶体管(IGBT)的可靠性研究为背景,针对IGBT模块现有热网络建模及耦合热阻抗提取方法的不足,提出一种采用离散化方波提取模块内部IGBT芯片及反并联二极管(FWD)之间耦合热阻抗的方法。该方法基于热敏电参数(TSEP)测量结温的原理和热网络响应特性,将IGBT模块视为一个黑盒子,通过基于模块端口TSEP的测量来建立其内部热学行为的等效热网络模型,从而可普遍适用于多种内部封装结构的模块。最后通过采用所提方法,对一款典型多芯片并联封装的模块进行实验测量,验证了所提方法的可行性和准确度。
On the background of insulate gate bipolar transistor(IGBT)reliability research,this paper aims at the shortage of current thermal modeling and the extraction method of coupled thermal impedance of IGBT modules,a new discrete square wave method to extract the coupled thermal impedance between IGBT and freewheeling diode(FWD)is proposed.Based on the principle of junction temperature measurement via thermo-sensitive electrical parameters(TSEP)and the response characteristics of the thermal network,the internal thermal behavior of IGBT can be established by the measurement of the port TSEP.The IGBT module are regarded as a black box,thus the proposed extraction method can be universally applicable to a variety of internal packaging structure module.Finally,the validity and the precision of the proposed method is verified through experiment.
作者
蔡杰
周雒维
彭英舟
孙鹏菊
杜雄
张雅希
Cai Jie;Zhou Luowei;Peng Yingzhou;Sun Pengju;Du Xiong(State Key Laboratory of Power Transmission Equipment&System Security and New Technology Chongqing University,Chongqing 400044,China)
出处
《电工技术学报》
EI
CSCD
北大核心
2018年第7期1440-1449,共10页
Transactions of China Electrotechnical Society
基金
国家自然科学基金重点项目(51137006)和国家自然科学基金(51577020))资助。
关键词
IGBT
耦合热阻抗
电热敏参数
离散化方波
IGBT
coupled thermal impedance
electro-thermal parameters
discrete square wave
