低银(Cu,La)复合掺杂Ag/SnO_2材料的制备及抗熔焊性能分析

Preparation of (Cu,La) Co-doped Ag/SnO_2 contact material with low silver content and anti-welding property

以CuO和La_2O_3为掺杂剂,采用高能球磨和热挤压工艺制备银含量82%的Ag/SnO_2电接触材料,将其与相同工艺制得的银含量88%的复合掺杂Ag/SnO_2电接触材料配对,在2 500A交流电流条件下进行抗熔焊性能测试.同时,利用扫描电子显微镜、X射线衍射仪等对材料性能和熔焊前、后微观组织形貌进行了表征.结果表明,制备的电接触材料中氧化物在银基体中分布较均匀;银含量82%的电接触材料的抗熔焊性能优于银含量88%的电接触材料,且熔焊测试后氧化物在银基体中分布均匀,没有出现团聚,而表面的SnO_2转化为SnO.

Using CuO and La2O3 as the doping agents,a co-doped Ag/SnO 2 contact material with silver content of 82%was prepared by high energy ball milling and hot extrusion process.Then,the anti-welding performance test was done between the co-doped Ag/SnO2 and another co-doped Ag/SnO2 with silver content of 88%by the same preparation process under 2 500A AC current.Next,the microstructures of contact materials were characterized by SEM and XRD before and after the welding performance.The results show that the oxides have uniform distribution in the contact materials prepared by high energy ball milling and hot extrusion process.Comparing to the silver content 88%co-doped Ag/SnO2 contact material,the silver content 82%co-doped Ag/SnO 2 material has more excellent performance of anti fusion.The oxides have uniform distribution in the contact materials after the welding test.The stannic oxide on the surface of the contact materials translates to tin(Ⅱ)oxide.