某机载电子设备中片式厚膜电阻器失效机理分析

Failure Mechanism Analysis of Chip Thick Film Resistor for an Airborne Electronic Equipment

对某机载电子设备中片式厚膜电阻器的失效机理进行了研究,结果表明:电阻器的失效与生产制作工艺流程中的微小偏差、长期使用过程中受到的机械及温度应力以及大气中有害气氛的侵蚀均有密切的关系,给出了预防措施及电阻器的选用建议。

The failure mechanism of chip thick film resistor for an airborne electronic equipment was researched.The result shows that the failure of the resistor is closely related to the minor deviation in the manufacturing process,the mechanical and temperature stress during the long-term using and the erosion of harmful gas in the atmosphere.The preventive measures and the selection advices of resistor are given.