陶瓷基板表面金属化研究现状与发展趋势

Research Situation and Development Trend of Ceramic Metallization

散热基板是大功率电子元器件散热的重要通道,其导热性能将直接影响功率型电子元器件的可靠性与使用寿命。详细介绍了陶瓷作为高导热的散热基板材料,其表面金属化的技术方案及发展现状,同时指出了各种金属化方案的关键技术难点,对比分析了各类陶瓷封装散热基板的特点与性能差异,并在此基础上对陶瓷基板的发展趋势进行预测。

Substrates,the thermal conductivity of which would directly impact on reliability and service life of powerful electronic components,Act as an important thermal path for their Packaging.In this paper,it has been introduced the techniques and current development of surface metallization of ceramic with high thermal conductivity and the key technical difficulties of each techniques.There is an introduction of distinguishing features of five different kinds of ceramic substrates and also a performance comparison among them.In the end,the developing trend of ceramic substrates has also been predicted in this paper.