T/R开关封装加速度仿真及测试

Analysis and Test of T/R Switch Shell Package

封装是T/R开关的关键环节。开关封装失效主要包括外壳失效和LTCC基板失效。为了避免T/R开关失效,利用ANSYS 14.0对封装进行模态仿真及加速度瞬态仿真,找出开关封装的加速度响应值以及受到应力时的频率特性,并通过随机试验和半正弦冲击试验验证仿真结果,验证封装可靠性。试验结果表明,目前的T/R开关封装可以保证组件能够承受40 g以上的加速度冲击和振动。

Packaging is the main part in T/R switch.The main mechanism of switch package failure concludes shell failure and LTCC bases failure.For in void of the packaging failure,we do modal analysis and transient analysis using ANSYS 14.0,get acceleration response value and inherent frequency of the shell,then have some experiments such as random vibration test and half-sinusoidal impact test to test the results of analysis and reliability.The results of experiments show that the shell package can ensure that the component can withstand impact and vibration of acceleration above 40 g.