全自动IC编带机封压机构研究

Research on Sealing Mechanism of Full Automatic IC Taping Machine

随着集成电路全产业链的迅猛发展,芯片版图面积大幅缩减,封装技术集成创新,器件微型化和SMT技术规模应用因其可靠、防震和稳定性已成为趋势。传统的料条、托盘等器件出货方式逐步被编带所取代。为了更好地匹配后道SMT设备的高速运转,对于编带的封压效果(载带和盖膜粘合)提出更高的要求。对全自动IC编带机封压机构进行了介绍,对一体式封压机构的改进进行了探讨。

With the integrated circuit the rapid development of the whole industry china,the layout of the chip area substantially reduced,packaging technology integration innovation,miniaturization and SMT scale applications has become a trend,because reliable,stable and shockproof.Traditional materials pallets and other devices shipped way is gradually replaced by tape.In order to better match the high-speed operation after SMT equipment,the sealing effect of the tape(tape and adhesive film cover)to put forward higher requirements especially the industry leading enterprises.