中国集成电路封测产业现状与创新平台

Status of IC Packaging and Testing Industry and Innovation Platform in China

半导体制造是我们见过所有制造业里最为复杂、最有科技含量的制造。与传统制造业不同。在后摩尔时代,国际半导体技术路线图已经明确将封装作为重要的发展路线,以系统级封装(SiP)为代表的多元化器件和功能集成的路线。02专项支持封测企业针对基板封装、多芯片封装、芯片叠层打线封装等高密度封装展开技术研发,量产技术涵盖了倒装焊、晶圆级封装、凸点技术等国际先进封测技术。国内企业共同组建了先进封装与系统集成创新平台。

Semiconductor manufacturing is the most complex and most scientific and technological production we have seen in all manufacturing industries.It is different from the traditional manufacturing industry.In the more Moore time,the international semiconductor technology roadmap has made clear the packaging as an important development route,taking system in package(SiP)as the representative of diversified devices and functional integration routes.China's 02 special project support for substrate packaging,packaging and testing companies multi chip package,chip laminated wire encapsulation of high density packaging expansion technology research and development,production technology covers the flip chip,wafer level packaging,bump technology and other international advanced packaging technology.Chinese enterprises have jointly established an advanced packaging and system integration innovation platform.