期刊文献+

考虑寄生参数影响的碳化硅MOSFET开关暂态分析模型 被引量:33

Analytical Switching Transient Model for Silicon Carbide MOSFET under the Influence of Parasitic Parameters
下载PDF
导出
摘要 为了评估回路及封装寄生参数对碳化硅MOSFET开关特性的影响,首先建立包括所有寄生参数的开关暂态等效电路模型,详细分析器件开通和关断整个开关暂态过程。然后,在考虑实际器件的负压偏置及器件寄生电容的非线性变化的基础上,推导碳化硅MOSFET所承受电气应力(电压过冲、电流过冲)的简化解析式。其次,基于开通和关断过程的小信号等效电路讨论振荡频率与寄生参数之间的关系。最后,通过对比实验和计算结果,验证了该分析模型的合理性,且能够反映出寄生参数碳化硅MOSFET开关特性的影响规律。 To assess the effects of loop and package parasitic parameters on silicon carbide MOSFET switching transient characterization,switching transient equivalent circuit model was firstly established under all the parasitic parameters,and the turn-on and turn-off transient process was analyzed in detail.Then,considering the negative bias voltage and the nonlinearity of device parasitic capacitance,simplified analytic expression of switching transient electric overstress was deduced.Furthermore,the relationship between oscillation frequency and parasitic parameters was also discussed,based on the small signal equivalent circuit.Eventually,the experimental and calculation results show that the analysis model is feasible and can reflect the influence of parasitic parameters on silicon carbide MOSFET switching characteristics.
作者 柯俊吉 赵志斌 谢宗奎 徐鹏 崔翔 Ke Junji;Zhao Zhibin;Xie Zongkui;Xu Peng;Cui Xiang(State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources North China Electric Power University,Beijing 102206 China)
出处 《电工技术学报》 EI CSCD 北大核心 2018年第8期1762-1774,共13页 Transactions of China Electrotechnical Society
基金 国家重点研发计划资助项目(2016YFB0400503)
关键词 碳化硅MOSFET 电气应力 振荡频率 寄生参数 分析模型 Silicon Carbide MOSFET electric overstress oscillation frequency parasitic parameter analytical model
  • 相关文献

参考文献8

二级参考文献134

  • 1李方正,徐勤富,赖建军,李光升.PiN二极管的一种改进型PSpice模型[J].电工技术学报,2011,26(S1):172-176. 被引量:5
  • 2严杰,王莉,王志强.基于Matlab的功率MOSFET建模[J].电力电子技术,2005,39(3):23-25. 被引量:6
  • 3Ueda H,Sugimoto M,Uesugi T,et al.Wide-bandgap semiconductor devices for automobile applications [C]//International Conference on Compound Semiconductor Manufacturing Technology.Vancouver,Canada:CS Mantech,2006:37-40.
  • 4Ye H,Yang Y,Emadi A.Traction inverters in hybrid electric vehicles[C]//Transportation Electrification Conference and Expo.Dearborn,USA:IEEE,2012:1-6.
  • 5沈征.硅功率半导体器件的发展动态与展望[R].广州,第六届高校电力电子与电力传动学术年会.2012.
  • 6Emadi A,Rajashekara K,Williamson S S,et al.Topological overview of hybrid electric and fuel cell vehicular power system architectures and configurations [J].IEEE Transactions on Vehicular Technology,2005,54(3):763-770.
  • 7Emadi A,Williamson S S,Khaligh A.Power electronics intensive solutions for advanced electric,hybrid electric,and fuel cell vehicular power systems[J].IEEE Transactions on Power Electronics,2006,21(3):567-577.
  • 8Emadi A,Lee Y J,Rajashekara K.Power electronics and motor drives in electric,hybrid electric,and plug-in hybrid electric vehicles[J].IEEE Transaction on Industry Electronic,2008,55(6):2237-2245.
  • 9Hamada K.Silicon Carbide,Vol.2:Power Devices and Sensors.Chapter 1:Present status and future prospects for electronics in electric vehicles/hybrid electric vehicles and expectations for wide-bandgap semiconductor devices[M].Weinheim:Wiley-VCH Press,2009.
  • 10Cooke M.Wide load potential for electric vehicles[J].Compounds & Advanced Silicon,2009,4(5):70-75.

共引文献236

同被引文献191

引证文献33

二级引证文献137

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部