大面积纳米压印光刻晶圆级复合软模具制造

Wafer-level composite mold for large-area nanoimprint lithography

为了解决大面积纳米压印所面临的大尺寸晶圆级复合软模具低成本制造的难题,对于当前广泛使用的大尺寸晶圆级双层复合软模具开展了理论分析、数值模拟和制造方法的系统研究。提出并建立了复合软模具脱模过程和气泡缺陷理论模型;利用ABAQUS工程模拟软件,揭示了大尺寸复合软模具影响脱模的因素和内在规律;提出一种大尺寸晶圆级双层复合软模具低成本制造方法,并完成了10.16cm(4inch)满片双层复合软模具复制的实验验证。研究结果为大尺寸复合软模具制造奠定了理论基础,并提供了一种低成本高质量制造大尺寸晶圆级双层复合软模具切实可行的方法。

In order to solve the problem of producing large-size and wafer-level composite flexible mold at low cost and high throughput for the large area NIL,this paper systematically investigated the theoretical model,numerical simulation and fabrication method for a large-size and wafer-level composite flexible mold with double-layer structures.Two models regarding the peel off demolding and the air bubble defects generated were proposed.Furthermore,the influence factors and laws of the peel demolding parameters for separating the replicated composite mold and the master mold were revealed by numerical simulation by using ABAQUS software.A manufacturing approach was presented to replicate the large size and wafer-level flexible mold with two-layer structures.Finally,a 4 inch full-wafer composite flexible mold was fabricated by using the proposed method and a 10.16 cm(4 inch)Si master.The studies in the paper are valuable in providing a theoretical basis for fabricating large-size and wafer-level composite mold,and offer a feasible and effective method to replicate large-size and wafer-level composite mold with low cost and high quality.