高功率航空电子系统IGBT封装设计初探

Initial exploration of IGBT package design for high power aircraft electronic systems

将集成气冷散热器的半导体封装设计用于高功率电子系统,证明散热器片传热模型简易。这是基于经验关系式的,既可用于简单的分析模型,也可用于从半导体芯片穿过多层封装结构到散热片底部散热器的热传导二维有限差分(FD)模型。这些模型允许在静态及瞬态超负载状况下,进行快速性能评定。在用于采用3D分析工具对更详细的评定选择候选布局前,探讨大范围的设计选择。完成风荷载试验,验证用于不同半导体器件布局的建模结果。结果表明,各种模型和试验结果之间具有良好的一致性。

The design of semiconductor packaging for the integrated air cooled radiator is used in high power electronic system,which proves that the heat transfer model of the radiator is simple.This is based on empirical relation.It can be applied to simple analytical models,and also to the two-dimensional finite difference(FD)model of heat conduction from semiconductor chip through multilayer packaging structure to the bottom of the radiator.These models allow for rapid performance evaluation under static and transient overloading conditions.Before using the 3D analysis tool to select the candidate layout for more detailed evaluation,a wide range of design options is discussed.The wind load test is completed to verify the modeling results for the layout of different semiconductor devices.The results show that there is a good consistency between the models and the experimental results.