底充胶固化模型研究

Research on Curing Model of Underfill

针对底充胶固化模型构建复杂的难题,提出了一种基于费米-狄拉克分布函数的底充胶固化模型。利用费米-狄拉克分布函数来描述底充胶固化过程中杨氏模量E和线膨胀系数αl随温度的变化规律,并借助有限元软件ANSYS,建立了由石英玻璃和底充胶两层材料构成的理论验证模型。模拟得到的边沿处法线方向位移和实测结果高度吻合。

To solve the problem that the construction of a curing model of underfill was complicated,a curing model of underfill was proposed based on the Fermi-Dirac distribution function. The Fermi-Dirac distribution function was used to describe the temperature dependence of both the Young's modulus E and the coefficient of linear expansion αlof the underfill in curing process. A theoretical verification model composed of quartz glass and underfill layer was built by using the ANSYS software. The simulated displacement along the normal direction at the edge is in good agreement with the measured data.