在片Multi-TRL校准技术研究

Research for on-wafer Multi-TRL calibration technology

美国NIST Multi-TRL校准技术实现在片散射参数(S参数)的精确校准测试,但国内尚未实现上述校准技术,致使在片测量准确度不能满足精密测试需求。在充分研究Multi-TRL算法并自主推导相关核心公式的基础上,开发Mutli-TRL校准软件CETC13,并对校准软件准确度进行验证。然后利用半导体工艺开展0.1~40 GHz Multi-TRL校准标准1312的设计和制作,通过衬底厚度、横截面的优化设计,该校准标准能有效抑制多模传输。CETC13校准软件与校准标准校准过的在片系统测量结果与国外相同等级的在片系统相比,在0.1~40 GHz频段内,传输幅度相差0.05~0.10 d B,相位相差0.05°~1.3°;反射幅度相差0.002~0.007,可解决国内在片S参数精确校准测试问题。

The accurate on-wafer scattering parameters calibration and measurement are realized by NIST Multi-TRL(multi-thru reflect line)calibration technology,but it is not implemented in domestic,leading to the limited on-wafer measurement accuracy.On the basis of researching the Multi-TRL algorithm in depth and deducing the relevant core formulations,a Multi-TRL calibration software CETC13 is developed,and it has been verified.The Multi-TRL calibration standards 1312 ranging from 0.1 GHz to 40 GHz based on the semiconductor technology is also designed and prepared.By optimizing the thickness of the substrate and cross section,the standards can effectively suppress multi-mode transmission.Compared to NIST on-wafer system of the same level,the measurement results of system calibrated by software CETC13 and standards 1312 shows that the transmission magnitude error is within 0.05-0.10 dB,the phase error is within0.05°-1.3°and the reflection amplitude error is within 0.002-0.007 under the frequency band from 0.1GHz to 40GHz,which solves the accuracy problem of calibration test for domestic on-wafer scattering parameters.