半导体激光熔覆Inconel 625粉末及其组织性能分析

Analysis of microstructure and properties of Inconel 625 powder cladded by semiconductor laser

通过单一工艺参数变化的Inconel625粉末激光熔覆试验研究激光功率、扫描速度对熔覆层形貌、宏观尺寸、稀释率等成形特征参数的影响规律,获得了稀释率低、冶金结合良好、无裂纹、无气孔缺陷的熔覆层成形工艺参数范围。对比分析不同成分熔覆层微观组织形貌及机械性能。结果表明,Inconel625熔覆层表面硬度显著提高,从结合面到熔覆层顶部,其组织依次为平面晶、粗大树枝晶、细小树枝晶,主要相为γ-Ni。耐高温环烷酸腐蚀实验结果显示,Inconel 625熔覆层较传统应对材料(316L、304、20#钢)的耐腐蚀性能好。

Inconel 625 powder was cladded by semiconductor laser with varying single process parameter,the effect of laser power,scanning speed on the cladding morphology,macroscopic size and dilution rate was studied.The formation process parameter range of the deposited layer with low dilution rate,good metallurgical bonding,no cracks,and no pore defects was obtained.The cladding microstructures and mechanical properties were also analyzed.The results show that the surface hardness of the cladding layer is gradually increased from the bonding surface to the top of the cladding layer,the microstructure of the cladding layer represents flat crystal,coarse dendrites and fine dendrites.The main phase of the cladding layer isγ-Ni.Acid corrosion tests with high temperature naphthenic show that Inconel 625 cladding layer has better corrosion resistance than traditional materials(316L,304,20#steel).