树脂金刚石切割线切割硅片延时现象分析

Analysis on delay phenomenon of resin diamond wire when slicing silicon

为消除树脂金刚石线切割硅片的延时现象,建立切割模型研究单颗金刚石树脂层退让性,分析退让量δ和切割线弓A的关系。理论研究表明:线弓的变化量和树脂层的退让量正相关。选不同硬度的树脂按相同工艺制备金刚石切割线,并进行单晶硅切割对比实验,用扫描电镜观察切割后的树脂金刚石线锯。发现:在相同的切割条件下,以较软的树脂制成的金刚石切割线其退让行为显著、线弓大、切割时间长。使用高强树脂,可增加树脂层的固化强度,降低树脂层的退让性,有效解决切割延时问题。

To erase the delay phenomenon of resin diamond wire slicing silicon,a slicing model was established to study the deformability of singCe diamond in resin layer.The relationship between shittδand the bending arc A was analyzed.Theoretical research indicates that there betweenδand A.Diamond wires were then made at the same condition but with resins of different hardness and the contrast tests were implemented.After slicing,the wires were observed by SEM.It is found that at the same slicing condition,diamond wire with softer resin deforms more,and thus with bigger bending arc and longer slicing time.In conclusion,resin with high strength will add the curing strength of resin layer and decrease the deformability,thus efficiently solving the slicing delay problem.