工件旋转磨削磨粒切深解析模型分析

Analysis on model of grain depth-of-cut of wafer rotational grinding

硬脆材料超精密磨削时的表面/亚表面损伤很大程度上由磨粒切削深度决定。为更好地仿真预测磨粒的切削深度,基于现有模型和实验结果之间的差异,分析预测切深偏小的问题。结合磨粒数偏差分析和单磨粒划擦实验结果,修正现有模型;修正后的有效磨粒数和表面粗糙度,虽然更贴近,但仍不能吻合实验结果。提出其他可能影响仿真结果的因素,如磨粒刃圆半径、最小切屑厚度等,为进一步完善仿真过程提供参考,以助于磨削工艺的开发和优化。

Grain depth-of--cut has a significant impact on surface-or subsurface-damage(SSD)of the ultraground parts of hard and brittle materials.Thus to better simulate and predict the depth-of--cut,the differences between prediction and result are analyzed,mainly about why prediction is smaller than resutt.The model is fixed according to deviation analysis on grain numbers and test result of single-grain scratch.However,the fixed model,though more accurate,still could not meet the results.Some other factors that might influence the simulation are put forward,such as radius of cutting and minimum thickness of chip,to provide reference for further development and promote the optimization of grinding parameters.