ENYA贴片机提升产能的设备改造

Equipment Modification of ENYA SMT Machine to Improve Production Capacity

当硅晶片(wafer)抛光机的产能大于贴片机产能时,如何提高贴片机的产能,使抛光机与贴片机两者的产能达到平衡,是研究的方向。通过对贴片机的观察、了解、测量等相关工作,确认只有提升贴片机贴片部分的速度,才能提升贴片机的产能。贴片机的贴片部分,只有提高硅片上升/下降电机的速度,才能提升贴片部分的速度。为此更换脉冲发生器、上升/下降电机及控制器等相关的部件,并且编写相关PLC控制程序,从而提高硅片升/降电机的速度。达到了抛光机产能与贴片机产能相匹配的预期目的:增加贴片机的产能51 840片/a。

When the capacity of silicon wafer polishing machine is greater than that of SMT machine.How to improve the capacity of SMT machine in order to reach the balance of them is the direction of this research.And through the observation,understanding,measurement and other related work with the SMT machine.Confirm that only enhance the SMT chip placement speed,so that we can enhance the capacity of SMT machine.The key is increasing the speed of the wafer rise/fall motor.For increasing the speed of the motor,we replace the pulse generator,lift/drop motor and controller and other related parts,and write the matched PLC control program.Thus,the speed of the wafer rise/fall motor is improved.Therefore,the idea of improving the capacity of SMT machine is the good way to improve the productivity of the polishing machine.The project achieve the intended purpose:increase the capacity of SMT machine by 51 840/a.