脉冲电镀参数对薄膜电路镀金层性能的影响

Effects of pulse parameters on properties of electroplated gold coating for thin film circuits

研究了薄膜电路脉冲电镀金过程中平均电流密度和占空比对镀金速率,镀金层表面形貌、表面粗糙度、厚度均匀性,以及微带线厚宽比的影响。结果表明,随平均电流密度或占空比增大,镀金速率和镀金层的表面粗糙度均增大,微带线的厚宽比减小。当平均电流密度为0.4 A/dm^2,占空比为30%时,所得镀金层的表面形貌最佳。当平均电流密度为0.4 A/dm^2,占空比为50%时,微带线的厚宽比最大。

The effects of average current density and duty cycle during pulsed gold electroplating of thin film circuits on deposition rate,surface morphology,roughness and thickness uniformity of gold coating,as well as the thickness-to-width ratio of microstrip were studied.With the increasing of average current density or duty cycle,the deposition rate and surface roughness of gold coating are increased,while the thickness-to-width ratio of microstrip is decreased.The gold coating obtained at an average current density of 0.45 A/dm2 and a duty cycle of 30%features the best surface morphology,and the one obtained at an average current density of 0.45 A/dm2 and a duty cycle of 50%has the highest thickness-to-width ratio of microstrip.