聚合物微球化学镀金属化的研究进展

Progress of research on metallization of polymer microspheres by electroless plating

介绍了聚苯乙烯(PS)、聚甲基丙烯酸甲酯(PMMA)等聚合物微球化学镀镍、铜和银的基本工艺步骤,综述了敏化、活化、表面改性等前处理以及还原剂、温度、添加剂等工艺条件对聚合物微球化学镀的影响。展望了聚合物微球金属化技术今后的发展。

The basic processes for electroless plating of Ni,Cu,and Ag on polystyrene(PS),poly(methyl methacrylate)(PMMA),and other polymer microspheres were introduced.The effects of pretreatments such as sensitization,activation,and surface modification,as well as reductant,temperature,additive,and other process conditions on electroless plating of polymer microspheres were reviewed.The future development of polymer microspheres metallization technology was prospected.