摘要
介绍了聚苯乙烯(PS)、聚甲基丙烯酸甲酯(PMMA)等聚合物微球化学镀镍、铜和银的基本工艺步骤,综述了敏化、活化、表面改性等前处理以及还原剂、温度、添加剂等工艺条件对聚合物微球化学镀的影响。展望了聚合物微球金属化技术今后的发展。
The basic processes for electroless plating of Ni,Cu,and Ag on polystyrene(PS),poly(methyl methacrylate)(PMMA),and other polymer microspheres were introduced.The effects of pretreatments such as sensitization,activation,and surface modification,as well as reductant,temperature,additive,and other process conditions on electroless plating of polymer microspheres were reviewed.The future development of polymer microspheres metallization technology was prospected.
作者
张坤鹏
唐谊平
ZHANG Kun-peng;TANG Yi-ping(School of Materials Science and Engineering,Zhejiang University of Technology,Hangzhou 310014,China)
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2018年第13期598-602,共5页
Electroplating & Finishing
关键词
聚合物微球
金属化
化学镀
核.壳复合物
前处理
表面改性
综述
polymer microsphere
metallization
electroless plating
core–shell composite
pretreatment
surface modification
review