2[2]Yukihiro KIUCHI, Masatoshi IJI, Development of Environmentally Safe Flame-Retarding Epoxy Resin Compounds without Halogen and Phosphorous Derivatives and Their Application to Printed Wiring Boards[J]. NEC Res. & Develop. , 2003, 44, 256 ～262
3[3]C. S. Wu, Y. L. Liu, Y. S. Chiu, Epoxy resins possessing flame retardant elements from silicon incorporated epoxy compounds cured with phosphorus or nitrogen containing curing agents[J]. Polymer,2002,43,4277 ～ 4284
4[5]Y. L. Liu, Y. J. Chen, W. L. Wei, Novel thermosetting resins based on 4-(N-maleimidophenyl) glycidylether I: preparation and characterization of monomer and cured resins [J]. polymer, 2003,44,6465 ～ 6473
5[8]H Atsuhito, M Yasuyuki. Epoxy resin composition for semiconductor encapsulation[P]. W0-02/057333, 2002-07-25
6[9]E Kazuhisa, N Nobuyuki, S Noriaki. Epoxy resin composition for encapsulating semiconductor[P]. EP-1174455, 2002-01-23
7[10]H Shimizu, K Niwa, M Tanaka. Epoxy resin composition and semiconductor device[P]. US-6521354, 2003-02-18
