浅谈覆铜板在PCB端评估的方法

Discussion on the method of copper plate evaluation on PCB

随着PCB产业的发展,PCB板材的各项性能的要求也逐渐提高。文章主要集成了覆铜板在PCB制作过程和成品中常见的测试方法,通过集成以上测试在同一款板上,来评估覆铜板的各项性能是否达到预期要求,以及PCB生产企业制程对覆铜板的加工能力,从而为后续公司业务的发展提供备选板材。

With the development of the PCB industry,the performance requirements of PCB plate are also improving.To evaluate whether the performance of CCL meets the expected requirements or not and judge the process capability of CCL in the company,this paper integrates the common test methods of CCL in PCB manufacturing process and finished products,so as to provide alternative boards for further development of the company's business.