图像传感器封装结构设计与分析

Design and analysis of package structure for image sensor

基于方形扁平无引脚封装QFN和小外形封装SOP两种封装形式设计了6种不同尺寸的图像传感器封装结构,利用有限元分析软件ANSYS对其进行了稳态温度分析。结果表明,QFN封装结构的3种方案最高温度分别为56.596,40.766和39.051℃;SOP封装结构的3种方案分别为43.53,45.015和40.536℃。QFN结构设计的散热性能要优于SOP,但SOP结构设计的整体温度相对比较均匀。最优方案为QFN的第3种设计方案,芯片整体结构尺寸为2.5 mm×2 mm×0.4 mm。

Based on QFN and SOP package forms,structures for image sensors in six different sizes were designed.The steady-state temperature analysis on the image sensors was conducted through ANSYS software.The result shows that the highest temperatures of three kinds of QFN package structures for image sensor are 56.596,40.766 and 39.051℃respectively,and the highest temperature of three kinds of SOP package structures for image sensor are 43.53,45.015 and 40.536℃respectively.Heat dissipation of QFN structure is superior to that of SOP,but the overall temperature of the SOP structure is relatively homogeneous.The optimal design for the image sensor is the third design of QFN in which the measurement of chip is 2.5 mm×2 mm×0.4 mm.