摘要
在含有0.1 mol/L CuCl_2·2H_2O的1-丁基-3-甲基咪唑六氟磷酸盐{[BMIM]PF_6}离子液体中加入0.001 mol/L 1,4-丁炔二醇(BYD),进行恒电位电沉积铜。通过循环伏安测量研究了BYD对铜电沉积电化学行为的影响,并采用扫描电子显微镜(SEM)和X射线衍射仪(XRD)表征了铜镀层的表面形貌和相组成。镀液中加入0.001 mol/L BYD后,铜电沉积的电化学行为无本质上的改变,所得铜镀层表面更细致,铜的(110)晶面的生长减弱,(200)晶面的生长则增强。
1,4-Butynediol(BYD)was added to 1-butyl-3-methylimidazolium hexafluorophosphate{[BMIM]PF6}ionic liquid containing 0.1 mol/L CuCl2·2H2O,and potentiostatic electrodeposition of copper was conducted in it.The effect of BYD on the electrochemical behavior of copper electrodeposition was studied by cyclic voltammetry.The surface morphology and phase structure were characterized by scanning electron microscopy and X-ray diffraction.The addition of BYD to the ionic liquid bath doesn’t change the electrochemical behavior of copper electrodeposition essentially,hinders the growth of Cu(110)plane,but makes the copper coatings more compact,and promotes the growth of Cu(200)plane
作者
黄芊芊
明庭云
张宁新
滕悦
孙杰
HUANG Qian-qian;MING Ting-yun;ZHANG Ning-xin;TENG Yue;SUN Jie(School of Environmental and Chemical Engineering,Shengyang Ligong University,Shengyang 110159,China)
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2018年第16期703-706,共4页
Electroplating & Finishing
基金
辽宁省大学生创新创业项目(201810144017)
