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基于CMOS平台的硅光子关键器件与工艺研究

Silicon Photonics Devices and Process Based on CMOS Platform
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摘要 面向互补金属氧化物半导体(CMOS)工艺兼容的硅基光互连体系,研制了包括光波导、光栅耦合器、刻蚀衍射光栅、偏振旋转分束器、光频梳以及3D互连新器件等的硅光子关键器件,并对相应器件的设计及工艺给出了最新的研究结果。基于以上关键硅光子器件进行了大规模光子集成,实现了片上集成的微波任意波形发生器,并集成了300多个光器件,包括高速调制、延迟线和热调等功能。面向数据通信研制了八通道偏振不敏感波分复用(WDM)接收器,解决了集成系统中的偏振敏感问题。 The core components for silicon-based optical interconnection system compatible with complementary metal oxide semiconductor(CMOS)platform is developed,including optical waveguides,grating couplers,etched diffraction gratings,polarization rotator-splitters,optical combs,and new devices for 3D optical interconnections.Based on the key silicon photonic devices,a large-scale photonic integration has been carried out to realize the on-chip integrated microwave arbitrary waveform generator,and more than 300 optical devices,including high-speed modulation,delay line and thermal modulation functions,have been integrated.An 8-channel polarization insensitive wavelength division multiplexing(WDM)receiver for data communication is developed,which solves the polarization sensitivity problem in integrated system.
作者 赵瑛璇 武爱民 甘甫烷 ZHAO Yingxuan;WU Aimin;GAN Fuwan(Shanghai Institute of Microsystem and Information Technology,Chinese Academy of Sciences,Shanghai 200050,China)
出处 《中兴通讯技术》 2018年第4期8-14,共7页 ZTE Technology Journal
基金 科技部重点研发计划(2016YFE0130000) 上海市自然科学基金(16ZR1442600) 上海市扬帆计划(18YF1428100)
关键词 硅光子技术 硅基光互连 大规模光子集成 silicon photonics technology optical interconnections large-scale photonics integration
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