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C/SiC复合材料切槽-推磨复合式平面加工实验研究

Research on C/SiC composites plane machining of the grooving-grinding technology
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摘要 针对C/SiC复合材料传统机械加工效率低、成本高的缺点,采用切槽-推磨复合式加工对平板C/SiC复合材料进行了实验研究,通过正交实验分析了不同因素对块占比和推磨力的影响规律,采用扫描电子显微镜对加工表面进行显微观测,分析了材料损伤形式。结果表明,C/SiC复合材料可采用切槽-推磨复合式加工方法,块占比可达到30%以上,具有较好的推磨加工效果。材料损伤形式主要为碳化硅基体微裂纹、碳纤维分层、断裂和界面层脱粘。 Aiming at traditional mechanical methods’disadvantages such as low efficiency and high cost of machining the C/SiC composites,adopting the grooving-grinding technology to machine the plane C/SiC composites.Analysising different parameters’effects to the lump ratio and grinding force in the machining process.Using the SEM observes the micromorphology of the machining surface and analysising the damage forms.The results show that the C/SiC composite can be machined by the grooving-grinding technology,and the lump ratio can up to more than 30%,which has a good effect.The damage forms of materials are mainly SiC matrix’s micro cracks,carbon fibers’segregation and fracture and interface debonding.
作者 刘谦 孟凡卓 田欣利 唐修检 王龙 LIU Qian;MENG Fanzhuo;TIAN Xinli;TANG Xiujian;WANG Long(National Defense Key Laboratory for Remanufacturing Technology,Army Academy of Armored Forces,Beijing 100072,CHN)
出处 《制造技术与机床》 北大核心 2018年第10期138-142,共5页 Manufacturing Technology & Machine Tool
关键词 C/SIC复合材料 切槽-推磨复合式加工 块占比 界面层脱粘 C/SiC composites grooving-grinding technology lump ratio interface debonding
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