摘要
采用阴极极化曲线和电化学阻抗谱测量,对比研究了三环唑和以2-烷基苯并咪唑为主要成分的有机保焊膜(OSP)分别在0.5 mol/L H_2SO_4和3.5%NaCl溶液中对铜腐蚀的抑制效果。结果表明:在0.5 mol/L H_2SO_4溶液中,三环唑能够有效抑制铜的腐蚀,而OSP膜在酸性环境中易溶解,因此对铜的保护不如三环唑;在3.5%NaCl溶液中,OSP膜对铜腐蚀的抑制效果比三环唑更优。上述结果通过微观形貌分析得到验证。
The inhibition effects of tricyclazole and organic solderability preservative(OSP,mainly composed of 2-alkylbenzimidazole)film on corrosion of copper were compared in 0.5 mol/L H2SO4 or 3.5%NaCl solution by cathodic polarization curve measurement and electrochemical impedance spectroscopy.The results showed that tricyclazole efficiently inhibits the corrosion of copper in 0.5 mol/L H2SO4 solution.The protection of OSP film on copper is not as good as the application of tricyclazole due to its easy dissolution in an acid medium.However,the OSP film has a better inhibitive effect on cooper corrosion than tricyclazole in 3.5%NaCl solution.These results were verified by microscopic morphology analysis.
作者
廖超慧
张胜涛
陈世金
何为
刘根
付登林
谭博川
刘超
郭茂桂
LIAO Chao-hui;ZHANG Sheng-tao;CHEN Shi-jin;HE Wei;LIU Gen;FU Deng-lin;TAN Bo-chuan;LIU Chao;GUO Mao-gui(School of Chemistry and Chemical Engineering,Chongqing University,Chongqing 401331,China)
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2018年第17期754-761,共8页
Electroplating & Finishing
基金
国家自然科学基金(21376282)
广东省"扬帆计划"先进印制电路关键技术研发及产业化项目(2015YT02D025)
重庆研究生创新基金(CYB17022)
关键词
三环唑
有机保焊膜
铜
腐蚀
抑制
电化学
表面形貌
tricyclazole
organic solderability preservative
copper
corrosion
inhibition
electrochemistry
surface morphology