三环唑和有机保焊膜对抑制铜在硫酸和氯化钠溶液中腐蚀的对比研究

Comparative study on inhibition of copper corrosion in sulfuric acid and sodium chloride solutions by tricyclazole and organic solderability preservative film

采用阴极极化曲线和电化学阻抗谱测量,对比研究了三环唑和以2-烷基苯并咪唑为主要成分的有机保焊膜(OSP)分别在0.5 mol/L H_2SO_4和3.5%NaCl溶液中对铜腐蚀的抑制效果。结果表明:在0.5 mol/L H_2SO_4溶液中,三环唑能够有效抑制铜的腐蚀,而OSP膜在酸性环境中易溶解,因此对铜的保护不如三环唑;在3.5%NaCl溶液中,OSP膜对铜腐蚀的抑制效果比三环唑更优。上述结果通过微观形貌分析得到验证。

The inhibition effects of tricyclazole and organic solderability preservative(OSP,mainly composed of 2-alkylbenzimidazole)film on corrosion of copper were compared in 0.5 mol/L H2SO4 or 3.5%NaCl solution by cathodic polarization curve measurement and electrochemical impedance spectroscopy.The results showed that tricyclazole efficiently inhibits the corrosion of copper in 0.5 mol/L H2SO4 solution.The protection of OSP film on copper is not as good as the application of tricyclazole due to its easy dissolution in an acid medium.However,the OSP film has a better inhibitive effect on cooper corrosion than tricyclazole in 3.5%NaCl solution.These results were verified by microscopic morphology analysis.