期刊文献+

树枝状介孔二氧化硅的制备及其负载纳米银的抗菌性 被引量:3

Preparation of Dendritic Mesoporous Silica and Its Antibacterial Properties of Loaded Nano Ag
下载PDF
导出
摘要 以正硅酸乙酯为硅源(TEOS),十六烷基三甲基溴化铵(CTAB)为表面活性剂,采用溶胶-凝胶法在氨水催化下制备树枝状介孔二氧化硅微球。以该微球为载体,原位负载纳米银。探究乙醚、硅烷结构助剂加入量对介孔二氧化硅微球的形貌、结构和粒径的影响,并通过抗菌实验测试其样品的最低抑菌浓度(MIC)和最小杀菌浓度(MBC)。结果表明:硅烷结构助剂和乙醚的加入对树枝状孔道的生成是至关重要的;纳米银负载到该介孔二氧化硅的MIC在3.16~3.95mg·L-1,MBC为6.32mg·L-1,优于纯纳米银。 Dendritic mesoporous silica microspheres were prepared by sol-gel method with ammonium as catalyst,TEOS as silica source and CTAB as surfactant.Nano Ag was in-situ loaded in the SiO 2 microspheres.The effect of different amounts of ether and silane structure promoter on the morphology,structure and particle size of dendritic mesoporous SiO 2 microspheres was studied.The minimum inhibitory concentration(MIC)and minimum bactericidal concentration(MBC)of the samples were tested by antibacterial examination.The results show that the addition of silane structure promoter and ether is crucial to the formation of dendritic pores.The MIC of nano Ag in the mesoporous silica is between 3.16mg·L^-1 and 3.95mg·L^-1,the MBC is 6.32mg·L^-1.Both of them are superior to pure nano Ag in antibacterial properties.
作者 黄连根 郑玉婴 HUANG Lian-gen;ZHENG Yu-ying(College of Materials Science and Engineering,Fuzhou University, Fuzhou 350108,China)
出处 《材料工程》 EI CAS CSCD 北大核心 2018年第10期135-141,共7页 Journal of Materials Engineering
基金 福建省科技厅引导性项目(2015H0016) 江苏省科技计划项目(BE2015147)
关键词 二氧化硅 表面活性剂 树枝状介孔微球 纳米银 抗菌 SiO 2 surfactant dendritic mesoporous microspheres nano silver antimicrobial activity
  • 相关文献

参考文献10

二级参考文献229

  • 1周英彦,高首山,李红霞,李莉香.关于成核速率公式的研究(Ⅰ)液相胶粒成核速率公式的简化近似表达式[J].中国粉体技术,2000,6(z1):287-290. 被引量:5
  • 2郑玉婴.氧化石墨烯纳米带与氧化石墨烯增强热塑性聚氨酯薄膜的制备及性能[J].高分子材料科学与工程,2015,31(4):180-185. 被引量:11
  • 3程明明,柴立元,彭兵,王建强.抗菌陶瓷的研究现状及展望[J].材料导报,2005,19(9):47-49. 被引量:6
  • 4SHI Y W, FANG W P, XIA Z D, et al. Investigation of rare earth-doped BiAg high temperature solders[J]. Journal of Materi- als Science: Materials in Electronics, 2010,21 (9) : 875 - 881.
  • 5MORISADA Y, NAGAOKA T, FUKUSUMI M A. Low tem- perature bonding process using mixed Cu-Ag nanopartieles[J]. Journal of Electronic Materials,2010,39(8):1283 1287.
  • 6AKADA Y, TASUM H, YAMAGUCHI T, et aI. Interracial bonding mechanism using silver metallo-organic nanoparticles to bulk metals and observation of sintering behavior[J]. Materials Transactions, 2008,49 (7) : 1537 - 1545.
  • 7HU A, GUO J Y, ALARIFI H. Low temperature sintering of Ag nanopartieles for flexible electronics packaging[J]. Applied Physics Letters,2010,97(15) :1-3.
  • 8IDE E, ANGATA S, HIROSE A, et aI. Metal-metal bonding processusing Ag metallo-organic nanoparticles[J]. Acta Materia- lia, 2005,53 (8) :2385-2393.
  • 9ZOU G S, YAN J F, MU F W. Low temperature bonding of Cu metal through sintering of Ag nanoparticles for high temperatureelectronic application [J]. The Open Surface Science Journal, 2011, (3) .- 70- 75.
  • 10YAN J F, ZOU G S, HU A M, et al. Preparation of polymer coated CuNPs and its applications for low temperature bonding [J]. Journal of Materials Chemistry,2011,21 : 15981 - 15986.

共引文献77

同被引文献15

引证文献3

二级引证文献2

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部