金刚石电镀液pH值恒定控制系统

p H Constant Control System of Diamond Electroplating Solution Based on Android

研究了一种基于Android的金刚石电镀液pH值恒定控制系统,实现了电镀过程中溶液pH值恒定不变。设计了步进电机驱动电路、RS232通讯、RS485通讯等硬件部分。该系统以STM32作为微处理器,通过步进电机加减速度算法使步进电机实现匀加减速运动。在pH值实时变化的电镀液控制系统中,采用多模态PID的算法,处理了复杂系统的中调节速度快、超调小难以兼得的问题。通过实验证明,该系统能控制电镀液pH在整个电镀过程中恒定且该系统最大超调量2%,控制精度可达±0.1。

This article studied a PH value control system of diamond plating solution based on Android.The system make the pH of this solution constant in all plating process.RS232 communication,RS485 communicationand stepper motor drive circuit are designed for the hardware component.The system uses STM32 as the controller and stepper motor uniform acceleration and deceleration motion is realized by acceleration and deceleration algorithm of stepper motor.The system deal with the problem of the adjusting speed and small overshoot in complicated by multi-mode PID in the changing system.Experiments are conducted to demonstrate that the system can control the ph of plating solution stable in all electroplating process.And the system maximum overshoot is 2%and the control accuracy reach依0.1.