一种新型无铅焊膏抗冷热循环性能

The Performance of Resistance to Hot and Cold Cycle of A New Lead-Free Solder Paste

对一种新型低银Sn-Ag-Cu-Bi-Ni(SACBN07)焊膏与市场上的SAC305焊膏进行抗冷热循环性能对比分析。比较冷热循环前后的微焊点的剪切强度和纳米压痕硬度、分析微量元素对界面组织以及力学性能的影响。结果表明:由于SACBN07中Bi元素的固溶强化和弥散强化的作用,冷热循环前SACBN07剪切强度和纳米压痕硬度值高于SAC305,SACBN07的剪切强度和体钎料的纳米压痕硬度受冷热循环影响较小,经过600h冷热循环后SACBN07焊点硬度降低了17. 4%,剪切强度降低了15. 3%,而SAC305焊点硬度降低了31. 3%,剪切强度降低了23%。SACBN07中Ni元素的加入减缓了界面化合物的生长速度,经过600 h冷热循环后SACBN07焊点界面IMC层厚度小于SAC305焊点。SACBN07的抗冷热循环性能优于SAC305。

The performance of resistance to hot and cold cycle of a new low silver solder paste Sn-Ag-Cu-Bi-Ni(SACBN07)and SAC305 solder paste on the market were compared and analyzed.The shear strength and nanohardness of micro solder joints before and after hot and cold cycles were compared,and the effect of trace elements on the microstructure of the interface and mechanical properties was analyzed.The results show that the shear strength and nanoindentation hardness of SACBN07 are higher than that of SAC305 due to the solid solution strengthening and dispersion strengthening of Bi element in SACBN07.Because of the shear strength of SACBN07 and the nanoindentation hardness of bulk solder affected little by hot and cold cycles,the hardness of solder joint is reduced by 17.4%and the shear strength is decreased by 15.3%on the SACBN07 solder joint after 600h hot and cold cycle,while the SAC305 solder hardness decreased by 31.3%,the shear strength decreased by 23%.The Ni element added in SACBN07 solder paste slows down the growth rate of the interfacial compound,and the thickness of the IMC layer on the SACBN07 solder joint is less than that of SAC305 solder joint after 600h hot and cold cycle.In a word,we get that the performance of SACBN07 solder paste is better than that of SAC305 solder paste.