添加剂对纳米压印模板光栅结构填充效果的改善作用

Usage of Additive for the Improvement of the Filling Effect during Filling the Grating Structure of the Nanoimprint Stamp

为改善电铸填充高深宽比纳米光栅结构时出现的空洞现象,本文向电铸液中添加平整剂健那绿,利用健那绿分子的静电吸附原理消除该工艺缺陷.结合纳米压印技术及电铸工艺,在柔性基底上完成了纳米压印镍模板的复制.复制过程中,首先通过热压将硅原始模板上的纳米光栅结构转移到聚合物基底上,制作出压印所需的软模板;然后采用溅射工艺在聚合物基底纳米结构表面沉积镍种子层并通过电铸工艺完成纳米光栅结构的填充及复制模板背板的生长;最后将铸层与聚合物基底进行分离.通过此工艺,成功复制了一块带有6个1.3mm×1.3mm纳米光栅区域的纳米压印镍模板,模板表面光栅周期为201nm,线宽98nm,深度104nm.与原始硅模板相比,复制模板特征尺寸偏差在5%以内,表明复制模板特征尺寸与相应原始模板特征尺寸之间有良好的一致性.热压实验后复制模板表面光栅结构周期无偏差,线宽偏差在2%以内,实验结果表明复制的纳米压印模板机械强度足以适用于热压过程.

In order to improve the voids phenomenon during filling the high-aspect-ratio nanograting structures using electroforming process,this paper uses the electrostatic adsorption principle of Janus green B molecule to eliminate the process defect by adding the leveling agent JGB to the electroforming bath.This paper completes the replication of nickel nanoimprint stamp on the flexible substrate via nanoimprint technology and electroforming process.In this process,the nanograting structures on the master silicon stamp are transferred to a polymer substrate using the hot embossing process to obtain soft template for embossing firstly;then,a seed layer of nickel is deposited on the polymer substrate nanostructure surface using sputtering process.The nanograting sructures are filled and the back plane of the replic is electroformed by electroforming process.Finally,the electroformed part and polymer are separated.Based on this process,a nickel nanoimprint stamp with six nano-grating areas of 1.3 mm×1.3 mm size,201 nm pitch,98 nm linewidth and 104 nm depth was replicated successfully.Compared with silicon master stamp,the error of the replicated stamp′s feature size is whthin 5%,the result shows good correlation between the dimensions of the replicated stamp′s features and the corresponding master stamp′s features.The pitch of the replicated stamp with grating structures has no error,the error of the linewidth is whthin 2%after hot-pressing process,the test result demonstrate that the mechanical strength of the replica is sufficient for the hot embossing process.