摘要
开展了基于Cu、Sn复合粉末的SiC芯片焊接材料研究。通过电镀工艺制备Cu、Sn复合粉末、液压成型制备预成型焊片以及三维网络接头结构的设计及焊接工艺研究,优化了Cu颗粒强化界面金属间化合物(IMCs)三维网络结构的制备工艺;研究了接头组织形貌演变规律及相变失效模式,揭示了接头失效机制,为高温SiC芯片焊接材料开发提供理论基础及技术指导。
In this paper,the SiC chip die-attached material based on preformed Cu、Sn composite powder has been developed.The disc shaped die attached materials are obtained by pressing the Cu、Sn composite powders which are prepared by electroplating Sn on Cu powders.Further three-dimensional network joint structure with Cu particle reinforced interface intermetallic compound(IMCs)network is achieved by optimizing reflow soldering process of the preform.The preparation of the microstructure evolution and phase transition failure mode of the joint are studied,and the failure mechanism of the joint is suggested.This paper provides a novel theory and technology for the development of high temperature SiC chip die-attached material.
作者
徐红艳
周润晖
宁圃奇
徐菊
XU Hong-yan;ZHOU Run-hui;NING Pu-qi;XU Ju(Institute of Electrical Engineering,Chinese Academy of Sciences,Beijing 100190,China;School of Materials Science and Engineering,Beihang University,Beijing 100191,China;University of Chinese Academy of Sciences,Beijing 100049,China)
出处
《电工电能新技术》
CSCD
北大核心
2018年第10期39-43,共5页
Advanced Technology of Electrical Engineering and Energy
基金
国家自然科学基金项目(51777203)
国家重点研发计划"新能源汽车重点专项"项目(2016YFB0100600)
中国科学院"百人计划"人才项目
关键词
Cu、Sn复合粉末
电镀
预成型
网络结构
失效机制
Cu、Sn composite powder
electroplating
preform
network structure
failure mechanism
