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LED照明标准光组件层级1技术规范探讨——封装器件

Discussion on Level 1 Technical Specification of LED Lighting Standard Optical Module : Package Device
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摘要 探讨LED标准光组件层级1——封装器件技术规范,结合LED照明产品的产业和质量特性,对LED标准光组件层级1——封装器件的技术规范提出修订建议。 This paper discusses the technical specification of LED lighting unit level 1:package device.Combined with the industrial and quality characteristics of LED lighting products,this paper puts forward some suggestions on the revision of the technical specification of LED lighting unit level 1:packaging device.
作者 刘莉 赖俊斌 LIU Li;LAI Jun-bin(Guangzhou Quality Supervision and Testing Institute(GQT), Guangzhou 511447,China)
出处 《科技创新发展战略研究》 2018年第5期34-38,共5页 Strategy for Innovation and Development of Science and Technology
基金 广东省科技计划项目"高品质低成本LED标准光组件产品的大规模制造技术研发和产业化"(2015B010132003)
关键词 LED标准光组件 封装器件 技术规范 修订建议 LED lighting unit package device technical specification revision suggestion
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