摘要
文章从IC集成度进步和组装技术发展角度和要求概述了PCB中高密精细化的线宽/间距是目前和今后发展的迫切任务。评述了PCB中高密精细化制造的难点和方法,目前和今后的一段时间内在传统工艺技术上进行改革创新发展仍然是主体方向!
This paper summarizes the current and future urgent task of high density and fine line width/spacing in PCB from the angle of IC integration progress and assembly technology development.The difficulties and methods of high density fine line manufacturing in PCB are reviewed.At present and in the future,the innovation and development of traditional process technology is still the main direction.
出处
《印制电路信息》
2018年第11期1-5,共5页
Printed Circuit Information
关键词
高密精细化
IC集成度
组装技术
线宽/间隔
High-Density Fine Line
IC Integration
Assembly Technology
Line/Width
