等离子体去钻污工艺对层间分离缺陷的改善研究

Study on the improvement of interlayer separation defects by plasma desmear process

层间分离(ICD)是沉铜工艺中的一种常见缺陷,ICD缺陷对PCB产品的可靠性有重大影响。文章通过对Plasma设备加工PCB产品过程的梳理,从ICD发生的原因出发,对Plasma加工流程、设备和控制环节进行分析和探讨,为业界同行对层间分离的预防和减少,提供一定的参考和借鉴。

Interlayer separation is a common defect in copper precipitation process.ICD defect has great influence on the reliability of PCB products.Based on sorting out the process of Plasma equipment processing PCB products and starting from the causes of ICD,this paper analyzes and discusses Plasma processing flow,equipment and control links,so as to provide some references for industry peers to prevent and reduce interlayer separation.