化学镍金板金渗镀问题的探讨

Study on excessive plating problem of ENIG boards

化学镍金工艺被广泛的应用于PCB行业。在实际生产中化学镍金板容易出现一些不良品质问题,比如渗金渗镀。本文结合具体生产实例,利用多种手段,对造成化学镍金板渗金渗镀问题的原因进行了研究和探讨。

Electroless nickel and immersion gold(ENIG)technology is widely used in PCB industry.ENIG board is prone to have some quality problems,such as the excessive plating.Based on real cases,the causation of excessive plating of ENIG boards were studied and analyzed in this paper.