小孔铜渣塞孔问题改善研究

Copper slag plugging little hole problem improvement research

对PCB电镀后的小孔孔内铜渣塞孔异常问题进行分析,分别从钻孔参数、化学镀铜线的过滤效果、钻刀型号和基板材料型号等四个方面进行研究,分析对小孔孔内铜渣塞孔问题的影响程度,最终确定小孔加工的最佳生产工艺条件。

This paper discusses the abnormal hole plug copper slag hole problem in post plating,respectively from the drilling parameters,the filtering effect of electroless plating copper line,drilling knife type and CCL type four aspects.It analyzes the small hole copper slag influence degree to the plug hole,and ultimately determines the optimal production technology of small hole machining conditions.